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depictio producti
The HJ30J Series Micro Rectangular High-Speed Connectors are designed for high-density, high-speed board-to-board interconnections in chassis and cabinet-level applications, offering excellent electrical performance and mechanical reliability in harsh environments.
Res maiora
- Flexible stranded pin contacts for enhanced reliability
- High-density contact layout with 1.27 mm × 1.27 mm pitch
- Metal shielding shell for superior EMI protection
- Available in 7 shell sizes: 12, 18, 24, 30, 36, 55, 100 contacts
- Ideal for high-speed signal transmission between boards
Technical Specifications
| Parameter | specification |
| Operating Temperature | -55 ° C ° C + 125 |
| Impedimentum proprium | 100 ± 15 Ω |
| rated current | A 3 |
| contactu resistentiam | ≤ 20 mΩ |
| Tensio dielectrica sustinenda | 800 V (temperatura cubiculi) |
| Nulla resistentia, | ≥ 5000 MΩ (500 VDC); ≥ 100 MΩ (wet heat) |
| Data transmission rate | XXXII ad Gbps |
| vita mechanica | 500 circuitus coeuntibus |
| vibrationis | 10–2000 Hz, 196 m/s² |
| Concursores | 735 m / h m |
